Nitan Technologies Providing Support all types of circuit assembly construction from Prototypes to mass volume. We handled O2O1 and finepitch components and Lead free PCB assembly. We have the ability to provide end-to-end solutions from our locations worldwide. We understand that the assembly industry is a skill and process intensive industry and so have invested to a great extent in technology and skills to ensure that our global customers have cost effective, scalable solutions that are developed using the best of technologies.

As electronic devices become more and more complex, smarter technologies evolve to counter the forces of market change. One such technology that was developed as a packaging alternative for high I/O devices was the ball grid array.